Invention Grant
- Patent Title: Integrated circuit module and method of forming the same
- Patent Title (中): 集成电路模块及其形成方法
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Application No.: US11878697Application Date: 2007-07-26
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Publication No.: US07799605B2Publication Date: 2010-09-21
- Inventor: Sung-Joo Park , Kyoung-Sun Kim , Jung-Joon Lee , Jea-Eun Lee
- Applicant: Sung-Joo Park , Kyoung-Sun Kim , Jung-Joon Lee , Jea-Eun Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2006-0071895 20060731
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/48
Abstract:
A method of forming an integrated circuit module may include interposing an auxiliary PCB between at least one semiconductor chip and a main PCB, the auxiliary PCB having at least one circuit pattern for electrical connection to one of the semiconductor chip and at least one circuit pattern formed on the main PCB.
Public/Granted literature
- US20080023702A1 Integrated circuit module and method of forming the same Public/Granted day:2008-01-31
Information query
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