Invention Grant
- Patent Title: Integrated module for data processing system
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Application No.: US12543144Application Date: 2009-08-18
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Publication No.: US07799613B2Publication Date: 2010-09-21
- Inventor: Bing Dang , John U. Knickerbocker , Cornelia K. Tsang
- Applicant: Bing Dang , John U. Knickerbocker , Cornelia K. Tsang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Yee & Associates, P.C.
- Agent Anne Dougherty
- Main IPC: H01L21/98
- IPC: H01L21/98
Abstract:
An apparatus for an integrated module. A silicon carrier with through-silicon vias has a plurality of die connected to a top side of the silicon carrier. In addition, a substrate is connected to a bottom side of the silicon carrier. The substrate is coupled to the plurality of die via the through-silicon vias.
Public/Granted literature
- US20090298236A1 Integrated Module for Data Processing System Public/Granted day:2009-12-03
Information query
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