Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US12232148Application Date: 2008-09-11
-
Publication No.: US07799645B2Publication Date: 2010-09-21
- Inventor: Jung-Dal Choi , Young-Woo Park , Jin-Taek Park , Chung-Il Hyun
- Applicant: Jung-Dal Choi , Young-Woo Park , Jin-Taek Park , Chung-Il Hyun
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2007-094278 20070917
- Main IPC: H01L21/8236
- IPC: H01L21/8236

Abstract:
An embodiment of a semiconductor device includes a substrate including a cell region and a peripheral region; a cell gate pattern on the cell region; and a peripheral gate pattern on the peripheral region, wherein a first cell insulation layer, a second cell insulation layer, and a third cell insulation layer may be between the substrate and the cell gate pattern, a first peripheral insulation layer, a second peripheral insulation layer, and a third peripheral insulation layer may be between the substrate and the peripheral gate pattern, and the second cell insulation layer and the third cell insulation layer include the same material as the respective second peripheral insulation layer and third peripheral insulation layer.
Public/Granted literature
- US20090072298A1 Semiconductor device and method of manufacturing the same Public/Granted day:2009-03-19
Information query
IPC分类: