Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12545702Application Date: 2009-08-21
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Publication No.: US07799672B2Publication Date: 2010-09-21
- Inventor: Junichi Hashimoto , Mitsuhiro Omura
- Applicant: Junichi Hashimoto , Mitsuhiro Omura
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2009-035030 20090218
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L21/44

Abstract:
A semiconductor device includes: a stacked body with a plurality of conductive layers and a plurality of dielectric layers alternately stacked therein, the stacked body including a staircase structure having the plurality of conductive layers processed into a staircase shape; an interlayer dielectric layer covering the staircase structure; and a contact electrode provided inside a contact hole penetrating through the interlayer dielectric layer, the contact hole penetrating through one of the staircase-shaped conductive layers, the contact electrode being in contact with a sidewall portion of the one of the staircase-shaped conductive layers exposed into the contact hole.
Public/Granted literature
- US20100207240A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2010-08-19
Information query
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