Invention Grant
- Patent Title: Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
- Patent Title (中): 金属抛光液用金属，金属研磨液，其制造方法以及使用其的研磨方法
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Application No.: US11715843Application Date: 2007-03-09
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Publication No.: US07799686B2Publication Date: 2010-09-21
- Inventor: Takeshi Uchida , Tetsuya Hoshino , Hiroki Terazaki , Yasuo Kamigata , Naoyuki Koyama , Yoshio Honma , Seiichi Kondoh
- Applicant: Takeshi Uchida , Tetsuya Hoshino , Hiroki Terazaki , Yasuo Kamigata , Naoyuki Koyama , Yoshio Honma , Seiichi Kondoh
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Hitachi, Ltd.,Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi, Ltd.,Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP10-372605 19981228; JP10-372608 19981228
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Provided are a metal-polishing liquid that comprises an oxidizing agent, an oxidized-metal etchant, a protective film-forming agent, a dissolution promoter for the protective film-forming agent, and water; a method for producing it; and a polishing method of using it. Also provided are materials for the metal-polishing liquid, which include an oxidized-metal etchant, a protective film-forming agent, and a dissolution promoter for the protective film-forming agent.
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