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Invention Grant
US07799712B2 Low-melting lead-free solder glass and uses thereof 有权
低熔点无铅焊锡玻璃及其用途

  • Patent Title: Low-melting lead-free solder glass and uses thereof
  • Patent Title (中): 低熔点无铅焊锡玻璃及其用途
  • Application No.: US12128847
    Application Date: 2008-05-29
  • Publication No.: US07799712B2
    Publication Date: 2010-09-21
  • Inventor: Dieter Goedeke , Peter Brix
  • Applicant: Dieter Goedeke , Peter Brix
  • Applicant Address: DE Mainz
  • Assignee: Schott AG
  • Current Assignee: Schott AG
  • Current Assignee Address: DE Mainz
  • Agent Michael J. Striker
  • Priority: DE102007025465 20070530
  • Main IPC: C03C3/066
  • IPC: C03C3/066 ;  C03C8/24
Low-melting lead-free solder glass and uses thereof
Abstract:
The low melting solder glass contains, in wt. % on an oxide basis, >1-2, SiO2; 5-10, B2O3; 4.5-12, ZnO; 79-88, Bi2O3; 0.0, CeO2; and 0.6-2, Al2O3, and a weight ratio of SiO2 to Al2O3 of
Abstract(Chinese):

低熔点焊料玻璃以重量计含有。 以氧化物为基准，> 1-2，SiO2; 5-10，B2O3; 4.5-12，ZnO; 79-88，Bi2O3; 0.0，CeO 2; 和0.6-2，Al2O3，SiO 2与Al 2 O 3的重量比<2。 焊料玻璃优选含有80.5〜85重量％ ％的Bi2O3，不含铅。 该焊锡玻璃具有<11.5×10 -6 / K的线性热膨胀系数α（20-300）和<380℃的相变温度Tg。用于将玻璃部件与金属部件连接或密封的焊料玻璃制剂 含有低熔点焊料玻璃和高达20wt。 ％的白云石，堇青石，莫来石，硅锌矿或锆石。

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