Invention Grant
- Patent Title: Organic metal complexes
- Patent Title (中): 有机金属配合物
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Application No.: US11826338Application Date: 2007-07-13
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Publication No.: US07799918B2Publication Date: 2010-09-21
- Inventor: Chih-Lung Chin , Wan Chi Chen , Kung-Lung Cheng
- Applicant: Chih-Lung Chin , Wan Chi Chen , Kung-Lung Cheng
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW95149475A 20061228
- Main IPC: C07F15/00
- IPC: C07F15/00 ; C09K11/06

Abstract:
An organic metal complex is provided. The organic metal complex has formula (I): wherein R1 includes hydrogen, C1˜C9 alkyl, C5˜C8 cycloalkyl, or substituted or non-substituted aromatic groups, R2 and R3 comprise hydrogen, fluorine, trifluoromethyl, C1˜C9 alkyl, C5˜C8 cycloalkyl, or substituted or non-substituted aromatic groups, Y comprises C—R or carbonyl, wherein R comprises hydrogen, C1˜C9 alkyl, C5˜C8 cycloalkyl, or substituted or non-substituted aromatic groups, L is a ligand, M comprises iridium, platinum, ruthenium, gold, or palladium, m is 1˜3, and n is 0˜2, wherein m+n is equal to the valence of M.
Public/Granted literature
- US20080214818A1 Organic metal complexes Public/Granted day:2008-09-04
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