Invention Grant
- Patent Title: Nonvolatile semiconductor memory device and manufacturing method thereof
- Patent Title (中): 非易失性半导体存储器件及其制造方法
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Application No.: US12108783Application Date: 2008-04-24
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Publication No.: US07800091B2Publication Date: 2010-09-21
- Inventor: Takeshi Kamigaichi , Hirofumi Inoue
- Applicant: Takeshi Kamigaichi , Hirofumi Inoue
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-119334 20070427
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
A nonvolatile semiconductor memory device includes a first stacked structure in which a plurality of electrode layers are stacked on a substrate via insulating layers, a first resistance changing layer provided on a side surface of the first stacked structure and in contact with the first electrode layers, the first resistance changing layer having a resistance value changing on the basis of an applied voltage, a second electrode layer provided on a side surface of the first resistance changing layer, and a bit line provided on the first stacked structure and electrically connected to the second electrode layer.
Public/Granted literature
- US20080265235A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2008-10-30
Information query
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