Invention Grant
- Patent Title: Light emitting diode component
- Patent Title (中): 发光二极管组件
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Application No.: US11312268Application Date: 2005-12-20
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Publication No.: US07800121B2Publication Date: 2010-09-21
- Inventor: Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
- Applicant: Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
- Applicant Address: US OH Cleveland
- Assignee: Lumination LLC
- Current Assignee: Lumination LLC
- Current Assignee Address: US OH Cleveland
- Agency: Fay Sharpe LLP
- Main IPC: H01L29/22
- IPC: H01L29/22 ; H01L29/227 ; H01L27/15 ; H01L29/267 ; H01L29/24
Abstract:
In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
Public/Granted literature
- US20060097245A1 Light emitting diode component Public/Granted day:2006-05-11
Information query
IPC分类:
