Invention Grant
- Patent Title: Semiconductor devices
- Patent Title (中): 半导体器件
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Application No.: US11795117Application Date: 2006-01-20
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Publication No.: US07800130B2Publication Date: 2010-09-21
- Inventor: Masahiro Sugimoto , Tetsu Kachi , Tsutomu Uesugi , Hiroyuki Ueda , Narumasa Soejima
- Applicant: Masahiro Sugimoto , Tetsu Kachi , Tsutomu Uesugi , Hiroyuki Ueda , Narumasa Soejima
- Applicant Address: JP Toyota-shi, Aichi-ken
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota-shi, Aichi-ken
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2005-022098 20050128
- International Application: PCT/JP2006/301262 WO 20060120
- International Announcement: WO2006/080413 WO 20060803
- Main IPC: H01L29/778
- IPC: H01L29/778

Abstract:
A semiconductor device 10 comprises a heterojunction between a lower semiconductor layer 26 made of p-type gallium nitride and an upper semiconductor layer 28 made of n-type AlGaN, wherein the upper semiconductor layer 28 has a larger band gap than the lower semiconductor layer 26. The semiconductor device 10 further comprises a drain electrode 32 formed on a portion of a top surface of the upper semiconductor layer 28, a source electrode 34 formed on a different portion of the top surface of the upper semiconductor layer 28, and a gate electrode 36 electrically connected to the lower semiconductor layer 26. The semiconductor device 10 can operate as normally-off.
Public/Granted literature
- US20080149964A1 Semiconductor Devices Public/Granted day:2008-06-26
Information query
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