Invention Grant
- Patent Title: Integrated circuit including a semiconductor device
- Patent Title (中): 包括半导体器件的集成电路
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Application No.: US11870750Application Date: 2007-10-11
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Publication No.: US07800171B2Publication Date: 2010-09-21
- Inventor: Mathias Von Borcke , Markus Zundel , Thorsten Meyer , Uwe Schmalzbauer
- Applicant: Mathias Von Borcke , Markus Zundel , Thorsten Meyer , Uwe Schmalzbauer
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102006048625 20061013
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
An integrated circuit including a semiconductor device is disclosed. One embodiment provides a load current component, having a multiplicity of trenches in a cell array. A sensor component is integrated into the cell array of the load current component and has a sensor cell array, the area of which is smaller than the area of the cell array of the load current component by a specific factor. The trenches forming the cell array of the sensor component correspond to the trenches of the cell array of the load current component, configured such that the trenches of the sensor component at the at least one side merge uniformly into the trenches of the cell array of the load current component without interruptions or disturbances of the trench geometry.
Public/Granted literature
- US20080088355A1 INTEGRATED CIRCUIT INCLUDING A SEMICONDUCTOR DEVICE Public/Granted day:2008-04-17
Information query
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