Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12464368Application Date: 2009-05-12
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Publication No.: US07800183B2Publication Date: 2010-09-21
- Inventor: Takahiro Okuno , Shigeru Kusunoki
- Applicant: Takahiro Okuno , Shigeru Kusunoki
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-021739 20090202
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
A semiconductor device includes a substrate of a first conductivity type, a base region of a second conductivity type, a source region of the first conductivity type, a collector region of the second conductivity type, a trench gate, which is formed in a trench via a gate insulation film, an electrically conductive layer, which is formed within a contact trench that is formed through the source region, a source electrode, which is in contact with the electrically conductive layer and the source region, and a latch-up suppression region of the second conductivity type, which is formed within the base region, in contact with the electrically conductive layer, and higher in impurity concentration than the base region. The distance between the gate insulation film and the latch-up suppression region is not less than the maximum width of a depletion layer that is formed in the base layer by the trench gate.
Public/Granted literature
- US20100193836A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-08-05
Information query
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