Invention Grant
US07800192B2 Backside illuminated image sensor having deep light reflective trenches
有权
具有深光反射沟槽的背面照明图像传感器
- Patent Title: Backside illuminated image sensor having deep light reflective trenches
- Patent Title (中): 具有深光反射沟槽的背面照明图像传感器
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Application No.: US12204743Application Date: 2008-09-04
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Publication No.: US07800192B2Publication Date: 2010-09-21
- Inventor: Vincent Venezia , Hsin-Chih Tai , Duli Mao , Sohei Manabe , Howard E. Rhodes , Wei Dong Qian
- Applicant: Vincent Venezia , Hsin-Chih Tai , Duli Mao , Sohei Manabe , Howard E. Rhodes , Wei Dong Qian
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H01L31/00
- IPC: H01L31/00
Abstract:
An array of pixels is formed using a substrate having a frontside and a backside that is for receiving incident light. Each pixel typically includes metallization layers included in the frontside of the substrate, a photosensitive region formed in the backside of the substrate, and a trench formed around the photosensitive region in the backside of the substrate. The trench causes the incident light to be directed away from the trench and towards the photosensitive region.
Public/Granted literature
- US20090200625A1 BACKSIDE ILLUMINATED IMAGE SENSOR HAVING DEEP LIGHT REFLECTIVE TRENCHES Public/Granted day:2009-08-13
Information query
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