Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12329987Application Date: 2008-12-08
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Publication No.: US07800204B2Publication Date: 2010-09-21
- Inventor: Hidenori Fujii
- Applicant: Hidenori Fujii
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-198338 20080731
- Main IPC: H01L29/868
- IPC: H01L29/868

Abstract:
A semiconductor device includes a stepwise impurity layer provided at one of an anode portion and an cathode portion of the semiconductor device by introducing an impurity of a predetermined conduction type from a major surface of the semiconductor substrate through to a first depth to provide a first region of the semiconductor substrate having the impurity of the predetermined conduction type introduced therein. The predetermined conduction type is a same conduction type as a conduction type of the one of the anode portion and the cathode portion. The stepwise impurity layer is further provided by melting a second, predetermined region of the semiconductor substrate having a second depth deeper than the first depth and including the first region to make uniform the impurity of the predetermined conduction type in a concentration from the major surface through to the second depth to provide a uniform stepwise impurity concentration profile.
Public/Granted literature
- US20100025827A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2010-02-04
Information query
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