Invention Grant
US07800205B2 Quad flat pack (QFP) package and flexible power distribution method therefor
有权
四平面封装（QFP）封装和灵活的配电方法
- Patent Title: Quad flat pack (QFP) package and flexible power distribution method therefor
- Patent Title (中): 四平面封装（QFP）封装和灵活的配电方法
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Application No.: US11216105Application Date: 2005-09-01
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Publication No.: US07800205B2Publication Date: 2010-09-21
- Inventor: Thomas O. Wheless, Jr. , Randall Don Briggs , Michael D. Cusack
- Applicant: Thomas O. Wheless, Jr. , Randall Don Briggs , Michael D. Cusack
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A Quad Flat Pack (QFP) package which includes first and second dies arranged in a side-by-side orientation, and a power supply bus which protrudes between adjacent sides of the first and second dies and which supplies power to the adjacent sides via connections to the adjacent sides.
Public/Granted literature
- US20070045809A1 Quad flat pack (QFP) package and flexible power distribution method therefor Public/Granted day:2007-03-01
Information query
IPC分类:
