Invention Grant
US07800212B2 Mountable integrated circuit package system with stacking interposer
有权
具有堆叠插入器的可安装集成电路封装系统
- Patent Title: Mountable integrated circuit package system with stacking interposer
- Patent Title (中): 具有堆叠插入器的可安装集成电路封装系统
-
Application No.: US11965641Application Date: 2007-12-27
-
Publication No.: US07800212B2Publication Date: 2010-09-21
- Inventor: In Sang Yoon , JoHyun Bae , HanGil Shin
- Applicant: In Sang Yoon , JoHyun Bae , HanGil Shin
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A mountable integrated circuit package system includes: forming a base integrated circuit package system includes: providing a first substrate, and forming a package encapsulation having a cavity over the first substrate with the first substrate partially exposed within the cavity; and mounting an interposer including a central aperture over the package encapsulation and the first substrate with the central aperture over the cavity.
Public/Granted literature
- US20090166834A1 MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING INTERPOSER Public/Granted day:2009-07-02
Information query
IPC分类:
