Invention Grant
US07800221B2 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer
失效
用于半导体晶片的密封装置，密封装置的模具和半导体晶片
- Patent Title: Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer
- Patent Title (中): 用于半导体晶片的密封装置，密封装置的模具和半导体晶片
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Application No.: US11878927Application Date: 2007-07-27
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Publication No.: US07800221B2Publication Date: 2010-09-21
- Inventor: Jiro Matsumoto
- Applicant: Jiro Matsumoto
- Applicant Address: JP Tokyo
- Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rabin & Berdo, P.C.
- Priority: JP2001-089851 20010327
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a lower mold having an area where the semiconductor wafer is mounted, the lower mold having an uneven surface in the area and a shock absorber under the lower mold.
Public/Granted literature
- US20080038400A1 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer Public/Granted day:2008-02-14
Information query
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