Invention Grant
US07800222B2 Semiconductor module with switching components and driver electronics
有权
具有开关元件和驱动电路的半导体模块
- Patent Title: Semiconductor module with switching components and driver electronics
- Patent Title (中): 具有开关元件和驱动电路的半导体模块
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Application No.: US11947279Application Date: 2007-11-29
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Publication No.: US07800222B2Publication Date: 2010-09-21
- Inventor: Martin Schulz , Uwe Jansen
- Applicant: Martin Schulz , Uwe Jansen
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Coats & Bennett, P.L.L.C.
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A semiconductor module comprises at least one semiconductor chip having at least one semiconductor switch. The at least one semiconductor chip is arranged on a carrier substrate. At least one driver component drives the at least one semiconductor switch. The at least one driver component is arranged on a circuit board. The at least one driver component has at least one input for receiving a control signal. The circuit board has a galvanic isolation in a signal path between the at least one driver component and the at least one semiconductor chip.
Public/Granted literature
- US20090140399A1 Semiconductor Module with Switching Components and Driver Electronics Public/Granted day:2009-06-04
Information query
IPC分类:
