Invention Grant
- Patent Title: Ball grid array package and substrate within
- Patent Title (中): 球栅阵列封装和衬底内
-
Application No.: US11453804Application Date: 2006-06-16
-
Publication No.: US07800231B2Publication Date: 2010-09-21
- Inventor: Yun-Han Chen
- Applicant: Yun-Han Chen
- Applicant Address: TW Hsin Tien, Taipei Hsien
- Assignee: Via Technologies, Inc.
- Current Assignee: Via Technologies, Inc.
- Current Assignee Address: TW Hsin Tien, Taipei Hsien
- Agency: Thomas, Kayden, Horstemeyer & Risley, LLP
- Priority: TW94125028A 20050722
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A ball grid array (BGA) package includes a substrate and a chip. A bottom surface of the substrate includes a central area and a marginal area. Several source balls are disposed in the central area. Several ball groups are disposed in the marginal area. Each ball group includes one ground ball and at most three signal balls. The chip is disposed on a top surface of the substrate and electrically connected to the substrate.
Public/Granted literature
- US20070018319A1 Ball grid array package and substrate within Public/Granted day:2007-01-25
Information query
IPC分类:
