Invention Grant
US07800237B2 Electronic device including a component stack and connecting elements, and connecting elements, and method for producing the electronic device
有权
包括组件堆叠和连接元件的电子设备，以及连接元件，以及用于制造电子设备的方法
- Patent Title: Electronic device including a component stack and connecting elements, and connecting elements, and method for producing the electronic device
- Patent Title (中): 包括组件堆叠和连接元件的电子设备，以及连接元件，以及用于制造电子设备的方法
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Application No.: US11764898Application Date: 2007-06-19
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Publication No.: US07800237B2Publication Date: 2010-09-21
- Inventor: Jochen Reisinger
- Applicant: Jochen Reisinger
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE102006028719 20060620
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
An electronic device includes a stack of electronic components and connecting elements. The component stack includes two components stacked one on top of another by their top sides. Contact areas are arranged on the top sides of the components, and the contact areas include external contact structures as connecting elements. The external contact structures on the contact areas include rib and/or trench structures oriented in such a way that the rib and/or trench structures of the contact areas of the components stacked one on top of another cross or intersect each other.
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Information query
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