Invention Grant
- Patent Title: Multi-chip packaged LED light source
- Patent Title (中): 多芯片封装LED光源
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Application No.: US11622753Application Date: 2007-01-12
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Publication No.: US07800304B2Publication Date: 2010-09-21
- Inventor: Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Kheng Leng Tan , Keat Chuan Ng , Kiam Soon Ong
- Applicant: Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Kheng Leng Tan , Keat Chuan Ng , Kiam Soon Ong
- Applicant Address: SG Singapore
- Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H05B33/00
- IPC: H05B33/00 ; F21S4/00

Abstract:
A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
Public/Granted literature
- US20080170391A1 Multi-chip Packaged LED Light Source Public/Granted day:2008-07-17
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