Invention Grant
- Patent Title: Dual mode ion source for ion implantation
- Patent Title (中): 用于离子注入的双模离子源
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Application No.: US11527994Application Date: 2006-09-26
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Publication No.: US07800312B2Publication Date: 2010-09-21
- Inventor: Thomas Neil Horsky
- Applicant: Thomas Neil Horsky
- Applicant Address: US MA North Billerica
- Assignee: SemEquip, Inc.
- Current Assignee: SemEquip, Inc.
- Current Assignee Address: US MA North Billerica
- Agency: Katten Muchin Rosenman LLP
- Agent John S. Paniaguas
- Main IPC: H05B31/26
- IPC: H05B31/26

Abstract:
A direct electron impact ion source is disclosed that includes a vaporizer for producing a process gas; an electron source for generating an electron beam; and an ionization chamber. The electron source is located outside the ionization chamber. Aligned apertures are provided in opposing walls of the ionization chamber to allow an electron beam to pass through the ionization chamber. The process gas is directed into the ionization chamber and ionized and extracted from the ionization chamber by way of an extraction aperture. In one embodiment, the direct electron impact ion source is configured with a form factor to enable it to be retrofit into the volume of an existing ion source , for example, an arc discharge type ion source. Alternatively, the direct electron impact ion source may be used together with an arc discharge ion source to create a dual mode or universal ion source.
Public/Granted literature
- US20070108394A1 Ion implantation ion source, system and method Public/Granted day:2007-05-17
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