Invention Grant
- Patent Title: Ultra-high bandwidth interconnect for data transmission
- Patent Title (中): 用于数据传输的超高带宽互连
-
Application No.: US11647842Application Date: 2006-12-29
-
Publication No.: US07800459B2Publication Date: 2010-09-21
- Inventor: Stephen H. Hall , Michael T. White , Howard Heck , Bryce D. Horine
- Applicant: Stephen H. Hall , Michael T. White , Howard Heck , Bryce D. Horine
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Robert D. Anderson
- Main IPC: H01P3/00
- IPC: H01P3/00 ; H01P5/08 ; H03H17/00
Abstract:
In some embodiments an interconnect includes a waveguide and a transmission line coupled in parallel with the waveguide. Other embodiments are described and claimed.
Public/Granted literature
- US20080157903A1 Ultra-high bandwidth interconnect for data transmission Public/Granted day:2008-07-03
Information query
