Invention Grant
US07800761B2 Infrared interferometric-spatial-phase imaging using backside wafer marks
有权
使用背面晶片标记的红外干涉 - 空间相位成像
- Patent Title: Infrared interferometric-spatial-phase imaging using backside wafer marks
- Patent Title (中): 使用背面晶片标记的红外干涉 - 空间相位成像
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Application No.: US11734402Application Date: 2007-04-12
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Publication No.: US07800761B2Publication Date: 2010-09-21
- Inventor: Euclid E. Moon
- Applicant: Euclid E. Moon
- Applicant Address: US MA Cambridge
- Assignee: Massachusetts Institute of Technology
- Current Assignee: Massachusetts Institute of Technology
- Current Assignee Address: US MA Cambridge
- Agency: Gauthier & Connors LLP
- Main IPC: G01B11/02
- IPC: G01B11/02

Abstract:
An interferometric-spatial-phase imaging (ISPI) system includes a substrate wafer. An alignment configuration is permanently embedded in the substrate wafer. The alignment configuration uses a global coordinate reference system by providing a plurality of global reference marks that encompass up to the entire substrate wafer. A plurality of alignment markings is provided on a surface in close proximity to the alignment configuration for obtaining continuous six-axis control of a scanning probe tip with respect to the global coordinate reference system.
Public/Granted literature
- US20070242271A1 INFRARED INTERFEROMETRIC-SPATIAL-PHASE IMAGING USING BACKSIDE WAFER MARKS Public/Granted day:2007-10-18
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