Invention Grant
- Patent Title: Heat exchange enhancement
- Patent Title (中): 热交换增强
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Application No.: US12057811Application Date: 2008-03-28
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Publication No.: US07800898B2Publication Date: 2010-09-21
- Inventor: Geoffrey Wen-Tai Shuy
- Applicant: Geoffrey Wen-Tai Shuy
- Applicant Address: HK Hong Kong
- Assignee: Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- Current Assignee: Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- Current Assignee Address: HK Hong Kong
- Agency: gPatent LLC
- Agent Stuart T. Auvinen
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20

Abstract:
A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces being in the elongated air ducts. The heat exchange structure includes a plurality of heat generators that are distributed on the exterior heat exchange surface along an elongated direction of the air ducts, in which air flowing in the air duct is heated successively by heat from the heat generators, and air flow in the air duct is enhanced by buoyancy of heated air.
Public/Granted literature
- US20090084530A1 Heat Exchange Enhancement Public/Granted day:2009-04-02
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