Invention Grant
US07800908B2 Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink
有权
具有由待冷却的功能元件形成的热源的装置，至少一个散热器以及位于热源和散热片之间的至少一个中间层
- Patent Title: Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink
- Patent Title (中): 具有由待冷却的功能元件形成的热源的装置，至少一个散热器以及位于热源和散热片之间的至少一个中间层
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Application No.: US10561433Application Date: 2004-06-02
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Publication No.: US07800908B2Publication Date: 2010-09-21
- Inventor: Jurgen Schulz-Harder , Ernst Hammel
- Applicant: Jurgen Schulz-Harder , Ernst Hammel
- Applicant Address: DE Eschenbach DE Klosterneuberg
- Assignee: Curamik Electronics GmbH,Electrovac AG
- Current Assignee: Curamik Electronics GmbH,Electrovac AG
- Current Assignee Address: DE Eschenbach DE Klosterneuberg
- Agency: Hoffman, Wasson & Gitler, P.C.
- Priority: DE10327530 20030617
- International Application: PCT/DE2004/001115 WO 20040602
- International Announcement: WO2004/067362 WO 20040812
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
The invention relates to a novel device made up of a heat source that is formed by at least one electrical or electronic component or is provided with such a component, a heat sink, and an intermediate layer which is located between the heat source and the heat sink and is made of a thermally conducting material. The thermally conducting material is made up of an organic matrix with incorporated nanofibers.
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