A wafer burn-in test circuit includes an address toggle signal generating unit for generating an address toggle signal in response to address signals having a constant time period, a reset signal generating unit for receiving a wafer burn-in mode activation signal, the address signals, and a reset determination signal among the address signals and then generating a reset signal, a refresh test mode signal generating unit for receiving the address toggle signal and the reset signal and then generating a refresh test mode signal, and a refresh period signal generating unit for receiving the address toggle signal and the refresh test mode signal and then generating a refresh period signal.