Invention Grant
US07801613B2 Metal injection molded titanium alloy housing for implantable medical devices
有权
用于可植入医疗器械的金属注射成型钛合金外壳
- Patent Title: Metal injection molded titanium alloy housing for implantable medical devices
- Patent Title (中): 用于可植入医疗器械的金属注射成型钛合金外壳
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Application No.: US11796116Application Date: 2007-04-26
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Publication No.: US07801613B2Publication Date: 2010-09-21
- Inventor: Bernard Li , Reginald D. Robinson , John E. Kast
- Applicant: Bernard Li , Reginald D. Robinson , John E. Kast
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Scott A. Marks; Rick L. Franzen
- Main IPC: A61N1/375
- IPC: A61N1/375
Abstract:
The housing of an implantable medical device is made of a titanium alloy that provides improved electrical performance, mechanical strength, and reduced MRI heating. The titanium alloy housing includes portions formed by metal injection molding and welded together. Wall thickness of at least a portion of one major face of the housing is reduced by chemical etching a metal injected molded housing portion.
Public/Granted literature
- US20080269829A1 Metal injection molded titanium alloy housing for implantable medical devices Public/Granted day:2008-10-30
Information query
IPC分类:
