Invention Grant
- Patent Title: Method and system for managing wafer processing
- Patent Title (中): 晶圆加工管理方法及系统
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Application No.: US11851008Application Date: 2007-09-06
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Publication No.: US07801636B2Publication Date: 2010-09-21
- Inventor: Nam-young Lee , Pil-woong Bang , Yeong-lyeol Park
- Applicant: Nam-young Lee , Pil-woong Bang , Yeong-lyeol Park
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2006-0092399 20060922
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
Disclosed are a method of managing a process and a process managing system in which a failure-generating process step can be quickly detected. The method of managing a process includes sequentially performing first to n-th (n is a natural number) process steps with respect to a plurality of wafers, the order that the plurality of wafers are processed in each of the n process steps are different from one another. Calculating characteristic parameter values for the plurality of wafers, calculating first to n-th relations that indicate relationships between the first to n-th process orders and the characteristic parameter values, performing a Fourier transform on the first to n-th relations so as to calculate first to n-th conversion relations, and determining the existence of patterns among the first to n-th relations using the first to n-th conversion relations.
Public/Granted literature
- US20080077269A1 METHOD AND SYSTEM FOR MANAGING WAFER PROCESSING Public/Granted day:2008-03-27
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