An I/O module for use with I/O devices such as pumps, valves, thermocouples, and mass flow controllers includes an application-specific integrated circuit (ASIC) associated with each electrical signal interface to an I/O device. Additionally, a matrix switch is incorporated into each of the ASICs in order to enable electrical signals related to the I/O device to be distributed between the ASICs. Matrix switches within the different ASICs are electrically connected by at least one signal path that is dedicated to electrical signal distribution within the I/O module and the matrix switches are configurable on an ASIC-by-ASIC basis such that the desired electrical signal distribution can be achieved on a per-application basis. Incorporating configurable matrix switches into the ASICs enables electrical signals to be easily distributed among the ASICs in an I/O module.