Invention Grant
US07802225B2 Optical proximity correction method, optical proximity correction apparatus, and optical proximity correction program, method of manufacturing semiconductor device, design rule formulating method, and optical proximity correction condition calculating method 有权
光学邻近校正方法,光学邻近校正装置和光学邻近校正程序,制造半导体器件的方法,设计规则制定方法和光学邻近校正条件计算方法

  • Patent Title: Optical proximity correction method, optical proximity correction apparatus, and optical proximity correction program, method of manufacturing semiconductor device, design rule formulating method, and optical proximity correction condition calculating method
  • Patent Title (中): 光学邻近校正方法,光学邻近校正装置和光学邻近校正程序,制造半导体器件的方法,设计规则制定方法和光学邻近校正条件计算方法
  • Application No.: US12026604
    Application Date: 2008-02-06
  • Publication No.: US07802225B2
    Publication Date: 2010-09-21
  • Inventor: Kaoru KoikeKohichi Nakayama
  • Applicant: Kaoru KoikeKohichi Nakayama
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Sonnenschein Nath & Rosenthal LLP
  • Priority: JP2007-029967 20070209
  • Main IPC: G06F17/50
  • IPC: G06F17/50
Optical proximity correction method, optical proximity correction apparatus, and optical proximity correction program, method of manufacturing semiconductor device, design rule formulating method, and optical proximity correction condition calculating method
Abstract:
In the present invention, there is provided an optical proximity correction method including steps of: extracting a gate length distribution of a gate from a pattern shape of the gate of a transistor to be formed on a wafer; calculating electric characteristics of the gate; determining a gate length of a rectangular gate having electric characteristics equivalent to the calculated electric characteristics; calculating a corrective coefficient for describing an associated relationship between a statistical value of the extracted gate length distribution and the determined gate length; extracting a gate length distribution of a gate of a transistor by printing the design pattern, and calculating a gate length distribution representative value from the statistical value of the gate length distribution using the calculated corrective coefficient; and correcting the design pattern so that the calculated gate length distribution representative value will be a specification value.
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