Invention Grant
- Patent Title: Method of manufacturing support structure for open MRI
- Patent Title (中): 开放式MRI支持结构的制造方法
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Application No.: US12039647Application Date: 2008-02-28
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Publication No.: US07802354B2Publication Date: 2010-09-28
- Inventor: Jian Mao , Jian Min Wang , Heng Liu , Anbo Wu
- Applicant: Jian Mao , Jian Min Wang , Heng Liu , Anbo Wu
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agency: Fletcher Yoder, PC
- Main IPC: B23P17/00
- IPC: B23P17/00 ; B23P21/00
Abstract:
A multi-layered support structure of an open magnetic resonance imaging (MRI) system, configured to provide high permeability to a magnetic flux from a source of a magnetic field, includes a first multi-layered support structure, a second multi-layered support structure and at least one third support structure, connecting the first multi-layered support structure and the second multi-layered structure.
Public/Granted literature
- US20080201930A1 SUPPORT STRUCTURE FOR OPEN MRI AND METHOD AND SYSTEM THEREOF Public/Granted day:2008-08-28
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