Invention Grant
- Patent Title: Method of forming plating film, method of manufacturing magnetic device and method of manufacturing perpendicular magnetic recording head
- Patent Title (中): 形成电镀膜的方法，制造磁性装置的方法和制造垂直磁记录头的方法
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Application No.: US11826146Application Date: 2007-07-12
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Publication No.: US07802357B2Publication Date: 2010-09-28
- Inventor: Akifumi Kamijima
- Applicant: Akifumi Kamijima
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-216106 20060808
- Main IPC: G11B5/187
- IPC: G11B5/187 ; C25D5/02
Abstract:
A method of forming a plating film capable of improving magnetic properties is provided. A photoresist pattern, having a first opening with an aspect ratio greater than 1 and a second opening with an aspect ratio smaller than that of the first opening, is formed on a surface of a substrate. A seed film is formed to cover an exposed surface of the substrate in the openings and an inner wall of the photoresist pattern in the openings. On the seed film in the openings, the plating film of magnetic material is deposited such that the first opening is filled under application of a magnetic field in the direction intersecting the surface of the substrate, and the second opening is filled under application of the magnetic field in the direction along the surface of the substrate.
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