Invention Grant
- Patent Title: Electronic component with heat transfer by boiling and condensation and method for producing same
- Patent Title (中): 通过沸腾冷凝进行热传递的电子部件及其制造方法
-
Application No.: US11826294Application Date: 2007-07-13
-
Publication No.: US07802437B2Publication Date: 2010-09-28
- Inventor: Jean-Antoine Gruss , Marc Plissonnier
- Applicant: Jean-Antoine Gruss , Marc Plissonnier
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Oliff & Berridge, PLC
- Priority: FR0606615 20060720
- Main IPC: F25D21/02
- IPC: F25D21/02 ; G01N21/00 ; H01L35/30

Abstract:
The electronic component with heat transfer by boiling and condensation comprises heat exchange surfaces immersed in a heat conducting fluid constituted by the free ends of nanowires of a thermoelectric converter. An electrically insulating coating material with a low thermal conduction partially covers the nanowires above the heat conducting fluid. Each nanowire forms a thermocouple composed of two coaxial branches made from materials of different natures separated by a layer of electrically insulating material and electrically connected individually to the free end of the nanowire.
Public/Granted literature
- US20080017356A1 Electronic component with heat transfer by boiling and condensation and method for producing same Public/Granted day:2008-01-24
Information query
IPC分类: