Invention Grant
US07802437B2 Electronic component with heat transfer by boiling and condensation and method for producing same 有权
通过沸腾冷凝进行热传递的电子部件及其制造方法

Electronic component with heat transfer by boiling and condensation and method for producing same
Abstract:
The electronic component with heat transfer by boiling and condensation comprises heat exchange surfaces immersed in a heat conducting fluid constituted by the free ends of nanowires of a thermoelectric converter. An electrically insulating coating material with a low thermal conduction partially covers the nanowires above the heat conducting fluid. Each nanowire forms a thermocouple composed of two coaxial branches made from materials of different natures separated by a layer of electrically insulating material and electrically connected individually to the free end of the nanowire.
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