Invention Grant
- Patent Title: High power microjet cooler
- Patent Title (中): 大功率微型喷墨冷却器
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Application No.: US12182304Application Date: 2008-07-30
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Publication No.: US07802442B2Publication Date: 2010-09-28
- Inventor: Raschid J. Bezama , Govindarajan Natarajan
- Applicant: Raschid J. Bezama , Govindarajan Natarajan
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: DeLio & Peterson, LLC
- Agent Kelly M. Nowak; Joseph Petrokaitis
- Main IPC: F25D23/12
- IPC: F25D23/12

Abstract:
A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.
Public/Granted literature
- US20080282720A1 HIGH POWER MICROJET COOLER Public/Granted day:2008-11-20
Information query
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