Invention Grant
- Patent Title: Jewelry clasp
- Patent Title (中): 珠宝扣
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Application No.: US11737048Application Date: 2007-04-18
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Publication No.: US07802448B2Publication Date: 2010-09-28
- Inventor: Lok Chan
- Applicant: Lok Chan
- Applicant Address: HK Tsuen Wan N.T.
- Assignee: H.K.C.J. (Asia) Ltd.
- Current Assignee: H.K.C.J. (Asia) Ltd.
- Current Assignee Address: HK Tsuen Wan N.T.
- Agency: Davis & Jack, L.L.C.
- Agent Kenneth H. Jack
- Main IPC: A44C5/00
- IPC: A44C5/00

Abstract:
A jewelry assembly incorporating a body portion, the body portion being halved, each half of the body portion including a magnetic fastener half; a strand anchoring pin and socket joint fixedly attached to one of the clasp's halves; a helically threaded void extending into the other of the clasp's halves; a helically threaded lug fitted for threaded engagement with the helically threaded void, and a flexible bead supporting strand spanning between and interconnecting the body portion's halves.
Public/Granted literature
- US20080256978A1 Jewelry Clasp Public/Granted day:2008-10-23
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