Invention Grant
- Patent Title: Automatic sliced piece fabricating apparatus and automatic sliced piece sample fabricating apparatus
- Patent Title (中): 自动切片制造装置和自动切片试样制造装置
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Application No.: US11651714Application Date: 2007-01-10
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Publication No.: US07802507B2Publication Date: 2010-09-28
- Inventor: Tetsumasa Ito , Tatsuya Miyatani , Koji Fujimoto
- Applicant: Tetsumasa Ito , Tatsuya Miyatani , Koji Fujimoto
- Applicant Address: JP Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba
- Agency: Brinks Hofer Gilson & Lione
- Priority: JP2006-009466 20060118
- Main IPC: G01N1/04
- IPC: G01N1/04 ; G01N1/06

Abstract:
To fabricate automatically a high quality sliced piece by preventing a temperature change of a surface of an enveloped block, there is provided an automatic sliced piece fabricating apparatus including a fixed base for mounting to fix an enveloped block, cutting means including a cut blade arranged on the fixed base for cutting out a sliced piece from the enveloped block by moving the cut blade and the fixed base relative to each other, a cabinet for containing the fixed base and the cutting means at inside thereof, sliced piece carrying means for carrying the cut-out sliced piece to outside of the cabinet, and temperature adjusting means for adjusting at least a surrounding temperature of the enveloped block to a predetermined temperature by supplying cold wind a temperature of which is controlled from outside at inside of the cabinet.
Public/Granted literature
- US20070204734A1 Automatic sliced piece fabricating apparatus and automatic sliced piece sample fabricating apparatus Public/Granted day:2007-09-06
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