A solid composition stick applicator is provided. The applicator comprises an applicator body having a first and second end, the second end having an opening through which a solid composition stick is dispensed. Within the applicator is housed a helical tension spring having a first spring end and a second spring end, the first spring end, second spring end, or both the first and second spring end held at a fixed position with respect to the applicator body. The helical tension spring is wound around a guide system that is housed within the applicator body. A pushing assembly is attached to the helical tension spring and the pushing assembly is movable from a first position at or near the first end of the applicator body, to a second position at or near the second end of the applicator body. Tension within the helical tension spring is greater in the first position than in the second position thereby urging the pushing assembly towards the second end of the applicator body. The use of a helical tension spring within the applicator greatly increases the life of the applicator under field conditions.