Invention Grant
- Patent Title: Microfluidic connections
- Patent Title (中): 微流体连接
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Application No.: US10599591Application Date: 2005-04-01
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Publication No.: US07802923B2Publication Date: 2010-09-28
- Inventor: Don W. Arnold , Kenneth R. Hencken , Sammy S. Datwani , Patrick Pak-Ho Leung , Douglas R. Cyr , Jason E. Rehm
- Applicant: Don W. Arnold , Kenneth R. Hencken , Sammy S. Datwani , Patrick Pak-Ho Leung , Douglas R. Cyr , Jason E. Rehm
- Applicant Address: US MA Framingham
- Assignee: AB Sciex LLC
- Current Assignee: AB Sciex LLC
- Current Assignee Address: US MA Framingham
- Agency: Sheldon Mak & Anderson
- International Application: PCT/US2005/011021 WO 20050401
- International Announcement: WO2005/096751 WO 20051020
- Main IPC: G02B6/36
- IPC: G02B6/36 ; G02B6/38

Abstract:
A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13,15; 23,25) or grooves (141,151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates. Novel apparatus and novel microfluidic assemblies, including microfluidic chips having grooves in their sides, are described.
Public/Granted literature
- US20090129728A1 Microfluidic Connections Public/Granted day:2009-05-21
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