Invention Grant
- Patent Title: Electronic device filter assembly
- Patent Title (中): 电子设备过滤器总成
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Application No.: US11881246Application Date: 2007-07-26
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Publication No.: US07803206B2Publication Date: 2010-09-28
- Inventor: Mark S. Tracy , Earl W. Moore
- Applicant: Mark S. Tracy , Earl W. Moore
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B01D46/00
- IPC: B01D46/00
Abstract:
A filter assembly includes a sleeve coupled to an external surface of an electronic device and disposed at least partially over an airflow vent of the electronic device, the sleeve configured to receive insertion of a filter element therein.
Public/Granted literature
- US20090025558A1 Electronic device filter assembly Public/Granted day:2009-01-29
Information query
