Invention Grant
- Patent Title: Multi-tiered, expandable panel structures and methods of manufacturing the same
- Patent Title (中): 多层,可扩展面板结构及其制造方法
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Application No.: US11826139Application Date: 2007-07-12
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Publication No.: US07803467B2Publication Date: 2010-09-28
- Inventor: Sean C. Dorsy
- Applicant: Sean C. Dorsy
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Main IPC: B21C27/00
- IPC: B21C27/00

Abstract:
A multi-tiered building structure. The multi-tiered building structure includes a panel member having a pattern of cuts, a pattern of legs, and a pattern of tabs configured to move the panel member between a nonexpanded position, wherein the panel member forms a substantially flat shape, and an expanded position, wherein the panel member forms a substantially stepped shape. The building structure also includes a support structure configured to accept at least one of the pattern of tabs of the panel member and maintain the panel member in the expanded position.
Public/Granted literature
- US20070256387A1 Multi-tiered, expandable panel structures and methods of manufacturing the same Public/Granted day:2007-11-08
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