Invention Grant
US07803511B2 Positive resist composition for immersion exposure and pattern-forming method using the same
有权
用于浸渍曝光的正型抗蚀剂组合物和使用其的图案形成方法
- Patent Title: Positive resist composition for immersion exposure and pattern-forming method using the same
- Patent Title (中): 用于浸渍曝光的正型抗蚀剂组合物和使用其的图案形成方法
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Application No.: US11503958Application Date: 2006-08-15
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Publication No.: US07803511B2Publication Date: 2010-09-28
- Inventor: Haruki Inabe , Hiromi Kanda , Kunihiko Kodama
- Applicant: Haruki Inabe , Hiromi Kanda , Kunihiko Kodama
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPP2005-238734 20050819
- Main IPC: G03F7/029
- IPC: G03F7/029
Abstract:
A positive resist composition for immersion exposure comprises: (A) a resin capable of increasing its solubility in an alkali developer by an action of an acid, and (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation, wherein the acid satisfies conditions of V≧230 and V/S≦0.93 taking van der Waals volume of the acid as V (Å3), and van der Waals surface area of the acid as S (Å2).
Public/Granted literature
- US20070042290A1 Positive resist composition for immersion exposure and pattern-forming method using the same Public/Granted day:2007-02-22
Information query
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