Invention Grant
- Patent Title: Semiconductor light-emitting device and a method for manufacturing the same
- Patent Title (中): 半导体发光器件及其制造方法
-
Application No.: US11362448Application Date: 2006-02-27
-
Publication No.: US07803645B2Publication Date: 2010-09-28
- Inventor: Michio Murata
- Applicant: Michio Murata
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2005-056398 20050301
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
The present invention is to provide a light-emitting device, a laser diode, formed without using the mechanical cleavage, and a process for manufacturing the device. The process comprises, after stacking semiconductor layers of the first cladding layer, the active layer, and the second cladding layer, a forming of a groove to define the laser resonator, the depth of which reaches the substrate, and the mass-transportation, within the groove, from the side surface of the groove in a portion of the substrate and the first cladding layer to the facet of the active layer and the second cladding layer. Since the facet layer thus transported reflects the crystal orientation of the side of the groove, the crystal quality of the facet layer can be maintained.
Public/Granted literature
- US20060205104A1 Semiconductor light-emitting device and a method for manufacturing the same Public/Granted day:2006-09-14
Information query
IPC分类: