Invention Grant
- Patent Title: Flip chip laser bonding process
- Patent Title (中): 倒装芯片激光焊接工艺
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Application No.: US11974783Application Date: 2007-10-16
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Publication No.: US07803661B2Publication Date: 2010-09-28
- Inventor: Sung-Wook Kim
- Applicant: Sung-Wook Kim
- Applicant Address: KR Changwon-si
- Assignee: Samsung Techwin Co., Ltd.
- Current Assignee: Samsung Techwin Co., Ltd.
- Current Assignee Address: KR Changwon-si
- Agency: Drinker Biddle & Reath LLP
- Priority: KR10-2007-0039741 20070424
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
An apparatus for heating a chip includes: a laser generator for emitting a laser beam to a semiconductor chip to heat the semiconductor chip; and a beam intensity adjuster disposed on a laser emission path between the semiconductor chip and the laser generator to equalize the intensity of the laser beam to be emitted to the semiconductor chip. A flip chip bonder having the chip heating apparatus, and a method for bonding a flip chip using the same are also provided.
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