Invention Grant
US07803664B2 Apparatus and methods for cooling semiconductor integrated circuit package structures
失效
用于冷却半导体集成电路封装结构的装置和方法
- Patent Title: Apparatus and methods for cooling semiconductor integrated circuit package structures
- Patent Title (中): 用于冷却半导体集成电路封装结构的装置和方法
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Application No.: US12115332Application Date: 2008-05-05
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Publication No.: US07803664B2Publication Date: 2010-09-28
- Inventor: Evan George Colgan , Gary Goth , Deborah Anne Sylvester , Jeffrey Allen Zitz
- Applicant: Evan George Colgan , Gary Goth , Deborah Anne Sylvester , Jeffrey Allen Zitz
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/34 ; H01L23/367
Abstract:
The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.
Public/Granted literature
- US20080242002A1 Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures Public/Granted day:2008-10-02
Information query
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