Invention Grant
US07804119B2 Device structures with a hyper-abrupt P-N junction, methods of forming a hyper-abrupt P-N junction, and design structures for an integrated circuit
失效
具有超陡P-N结的器件结构,形成超陡P-N结的方法,以及集成电路的设计结构
- Patent Title: Device structures with a hyper-abrupt P-N junction, methods of forming a hyper-abrupt P-N junction, and design structures for an integrated circuit
- Patent Title (中): 具有超陡P-N结的器件结构,形成超陡P-N结的方法,以及集成电路的设计结构
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Application No.: US12099316Application Date: 2008-04-08
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Publication No.: US07804119B2Publication Date: 2010-09-28
- Inventor: Jeffrey B. Johnson , Alvin J. Joseph , Robert M. Rassel , Yun Shi
- Applicant: Jeffrey B. Johnson , Alvin J. Joseph , Robert M. Rassel , Yun Shi
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Wood, Herron & Evans, LLP
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
Device structures with hyper-abrupt p-n junctions, methods of forming hyper-abrupt p-n junctions, and design structures for an integrated circuit containing devices structures with hyper-abrupt p-n junctions. The hyper-abrupt p-n junction is defined in a SOI substrate by implanting a portion of a device layer to have one conductivity type and then implanting a portion of this doped region to have an opposite conductivity type. The counterdoping defines the hyper-abrupt p-n junction. A gate structure carried on a top surface of the device layer operates as a hard mask during the ion implantations to assist in defining a lateral boundary for the hyper-abrupt-n junction.
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