Invention Grant
US07804174B2 TFT wiring comprising copper layer coated by metal and metal oxide
有权
TFT布线包括由金属和金属氧化物涂覆的铜层
- Patent Title: TFT wiring comprising copper layer coated by metal and metal oxide
- Patent Title (中): TFT布线包括由金属和金属氧化物涂覆的铜层
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Application No.: US11100432Application Date: 2005-04-07
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Publication No.: US07804174B2Publication Date: 2010-09-28
- Inventor: Makoto Sasaki , Gee Sung Chae
- Applicant: Makoto Sasaki , Gee Sung Chae
- Applicant Address: KR Seoul
- Assignee: LG Display Co., Ltd.
- Current Assignee: LG Display Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A gate electrode (wiring) (40) having a Cu layer (40a) surrounded by a coating film (40b) made of titanium or titanium oxide; a TFT substrate (31) comprising the gate electrode (wiring) (40) and a LCD comprising a pair of opposing substrates and a liquid crystal disposed between the opposing substrates, wherein one of the pair of opposing substrates is a TFT substrate (31), are disclosed.
Public/Granted literature
- US20070102818A1 Wiring, TFT substrate using the same, manufacturing method of TFT substrate, and LCD. Public/Granted day:2007-05-10
Information query
IPC分类:
