Invention Grant
US07804287B2 Low heat dissipation I/O module using direct drive buck converter
有权
低散热I / O模块采用直接驱动降压转换器
- Patent Title: Low heat dissipation I/O module using direct drive buck converter
- Patent Title (中): 低散热I / O模块采用直接驱动降压转换器
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Application No.: US11680228Application Date: 2007-02-28
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Publication No.: US07804287B2Publication Date: 2010-09-28
- Inventor: Dale R. Terdan , Xiaofan Chen
- Applicant: Dale R. Terdan , Xiaofan Chen
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Boyle Fredrickson LLP
- Agent R. Scott Speroff; John M. Miller
- Main IPC: H02M3/156
- IPC: H02M3/156
Abstract:
A current-loop output circuit for an industrial controller provides for low power dissipation and reduced part count by driving current loads of different resistances directly from a switched voltage source. Proper filtering and design of a feedback loop allows the necessary transient response times to be obtained.
Public/Granted literature
- US20080204084A1 LOW HEAT DISSIPATION I/O MODULE USING DIRECT DRIVE BUCK CONVERTER Public/Granted day:2008-08-28
Information query
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