Invention Grant
- Patent Title: Semiconductor test device with heating circuit
- Patent Title (中): 带加热电路的半导体测试装置
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Application No.: US11673714Application Date: 2007-02-12
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Publication No.: US07804291B2Publication Date: 2010-09-28
- Inventor: Seung H. Kang , Lisa E. Mullin , Subramanian Karthikeyan , Sailesh M. Merchant
- Applicant: Seung H. Kang , Lisa E. Mullin , Subramanian Karthikeyan , Sailesh M. Merchant
- Applicant Address: US PA Allentown
- Assignee: Agere Systems Inc.
- Current Assignee: Agere Systems Inc.
- Current Assignee Address: US PA Allentown
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/319 ; G01R31/28
Abstract:
A semiconductor test device includes a test circuit having contacts for applying an electrical signal and measuring electrical parameters of the test circuit. The semiconductor test device also includes an integrally formed heating circuit comprising at least one circuit meander positioned adjacent the test circuit for raising a temperature within a portion of the test circuit.
Public/Granted literature
- US20070168818A1 SEMICONDUCTOR TEST DEVICE WITH HEATING CIRCUIT Public/Granted day:2007-07-19
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