Invention Grant
- Patent Title: Capacitive distance sensing in semiconductor processing tools
- Patent Title (中): 半导体处理工具中的电容距离感测
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Application No.: US11708653Application Date: 2007-02-20
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Publication No.: US07804306B2Publication Date: 2010-09-28
- Inventor: DelRae H. Gardner , Craig C. Ramsey , Dana L Patelzick
- Applicant: DelRae H. Gardner , Craig C. Ramsey , Dana L Patelzick
- Applicant Address: US OR Wilsonviller
- Assignee: CyterOptics Semiconductor, Inc.
- Current Assignee: CyterOptics Semiconductor, Inc.
- Current Assignee Address: US OR Wilsonviller
- Agency: Westman, Champlin & Kelly, P.A
- Agent Christopher R. Christenson
- Main IPC: G01R27/26
- IPC: G01R27/26
Abstract:
A wireless sensor includes at least one capacitive plate for sensing a distance relative to an object of interest within a semiconductor-processing environment. The sensor includes an internal power source and wireless communication such that distance and/or parallelism measurements effected using the capacitive plate(s) can be provided wirelessly to an external device.
Public/Granted literature
- US20070222462A1 Capacitive distance sensing in semiconductor processing tools Public/Granted day:2007-09-27
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